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TELCORDIA GR-1221-CORE-1999-01 Generic Reliability Assurance Requirements for Pa

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Contents Contents
-----------------
Preface ..................................................................... Preface–1
1. Introduction...................................................................1–1
1.1 Scope and Purpose ......................................................1–1
1.2 Changes in the Document .................................................1–2
1.2.1 Changes From TA-NWT-001221 Issue 2 to GR-1221-CORE Issue 1 .....................1–2
1.2.2 Changes From GR-1221-CORE, Issue 1 to Issue 2.................1–3
1.2.3 Future Additions/Changes........................................1–3
1.3 Related Bellcore Documents.............................................1–4
1.4 Requirements Terminology...............................................1–4
1.5 Requirement Labeling Conventions........................................1–5
1.5.1 Numbering of Requirement and Related Objects ..................1–5
1.5.2 Requirement, Conditional Requirement, and Objective Object Identification ..........1–5
1.6 Operating Environments .................................................1–6
1.6.1 Central Office (CO) Environment..................................1–6
1.6.2 Remote Terminal (RT) Environment ...............................1–6
1.6.3 Uncontrolled Environment.......................................1–7
1.7 Other Terminology......................................................1–7
1.7.1 Suppliers, Vendors, and Manufacturers ...........................1–7
1.7.2 Quality Levels ....................................................1–7
2. Reliability Assurance - Overview and Philosophy ...............................2–1
2.1 Overview of Reliability Assurance .......................................2–1
2.2 Generic Requirements Philosophy........................................2–2
3. Basic Reliability Assurance Program Requirements ..............................3–1
3.1 Vendor and Device Qualification..........................................3–1
3.1.1 Specification and Control.........................................3–2
3.1.2 Vendor Approval................................................3–2
3.1.3 General Criteria for Device Qualification..........................3–3
3.1.3.1 Qualification Tests.....................................3–4
3.1.3.2 Device Codes that Fail Qualification.....................3–4
3.1.3.3 Qualification of Devices by Similarity ..................3–4
3.1.3.4 Use of Nonconforming Devices for Qualification.........3–5
3.1.3.5 Provisional Use of Devices..............................3–5
3.1.3.6 Low Volume Parts .....................................3–6
3.1.3.7 Hermeticity ............................................3–7
3.1.3.8 Solder Flux.............................................3–7
3.1.3.9 Use of Vendor-Supplied Data............................3–7
3.1.3.10 Treatment of Internally Manufactured Devices...........3–8
3.1.4 Environment, Health, and Safety Considerations ..................3–8
3.1.4.1 Environment Considerations ...........................3–8
3.1.4.2 Health Considerations..................................3–8
3.1.4.3 Safety Considerations ..................................3–9
3.1.5 Other General Information for Qualification .......................3–9
3.1.6 Requalification ................................................. 3–12
3.2 Lot-To-Lot Quality and Reliability Controls .............................. 3–13
3.2.1 General Criteria for Lot Controls................................. 3–14
3.2.1.1 Definition of a Lot ..................................... 3–14
3.2.1.2 Purchase Specifications ............................... 3–15
3.2.1.3 Source Inspection/Incoming Inspection ................ 3–15
3.2.1.4 Ship-to-Stock Programs............................... 3–16
3.2.1.5 Test Plan .............................................. 3–17
3.2.1.6 Test Equipment........................................ 3–17
3.2.1.7 Data Recording and Retention......................... 3–17
3.2.1.8 Treatment of Defective Devices and Lots ............... 3–18
3.2.1.9 Summary of Vendor History Data..................... 3–18
3.2.1.10 Low Volume Parts ..................................... 3–18
3.2.1.11 Use of Vendor-Supplied Data.......................... 3–19
3.2.1.12 Treatment of Internally Manufactured Devices......... 3–19
3.2.2 Other General Information for Lot-To-Lot Controls ............... 3–19
3.3 Standardized Test Procedures ........................................... 3–20
3.4 Feedback and Corrective Action......................................... 3–20
3.4.1 Incoming Inspection and Screening............................... 3–22
3.4.2 System-Level Testing .......................................... 3–22
3.4.3 Repair of Field Returns .......................................... 3–22
3.4.4 Data Collection and Analysis..................................... 3–23
3.4.5 Unconfirmed Failures .......................................... 3–23
3.4.6 Device Failure Analysis ......................................... 3–23
3.5 Device Storage and Handling............................................ 3–24
3.5.1 Nonconforming Material........................................ 3–24
3.5.2 Material Review System ........................................ 3–24
3.5.3 Stockroom Inventory Practices .................................. 3–25
3.5.3.1 FIFO Inventory Policy................................. 3–25
3.5.3.2 Reworked Parts........................................ 3–25
3.5.4 ESD............................................................ 3–25
3.6 Documentation and Test Data........................................... 3–26
3.6.1 Availability of Documentation................................... 3–26
3.6.2 Availability of Other Information ................................ 3–27
3.7 Availability of Devices ................................................. 3–28
4. Specific Reliability and Quality Criteria.........................................4–1
4.1 Qualification of Passive Optical Devices..................................4–1
4.1.1 Characterization .................................................4–1
4.1.2 Reliability Tests .................................................4–2
4.2 Qualification of Integrated Passive Optical Module.........................4–7
4.3 Quality Assurance and Lot Controls .......................................4–8
4.3.1 Visual Inspection................................................4–8
4.3.2 Optical Testing...................................................4–8
4.3.3 Stress Screening .................................................4–9
4.3.4 Optical Adhesives .............................................. 4–11
4.3.5 Optical Fiber .................................................... 4–11
4.4 Reliability and Quality of Optical Adhesives ............................. 4–11
4.4.1 Qualification and Requalification ................................ 4–12
4.4.2 Raw Material Storage........................................... 4–14
4.4.3 Lot-To-Lot Controls............................................. 4–14
5. Performance Criteria ...........................................................5–1
5.1 Optical Requirements and Objectives .....................................5–1
5.2 Optical Test Procedures ..................................................5–1
5.3 Optical Fiber and Optical Connectors.....................................5–1
6. Reliability Test Procedures .....................................................6–1
6.1 Reliability Test Pass/Fail Criteria .........................................6–1
6.2 Reliability Test Procedures ...............................................6–2
6.2.1 Mechanical Shock (Impact Test) .................................6–2
6.2.2 Variable Frequency Vibration Test................................6–3
6.2.3 Thermal Shock Test .............................................6–3
6.2.4 High Temperature Storage Test (Dry Heat).........................6–4
6.2.5 High Temperature Storage Test (Damp Heat) .....................6–4
6.2.6 Low Temperature Storage Test....................................6–5
6.2.7 Temperature Cycling Test........................................6–6
6.2.8 Cyclic Moisture Resistance Test..................................6–6
6.2.9 Residual Gas Analysis ...........................................6–7
6.2.10 ESD Threshold...................................................6–7
Appendix A: Lot Tolerance Percentage Defective (LTPD) Table ..................... A–1
Appendix B: Reliability Calculation ................................................ B–1
References ............................................................... References–1
Glossary ...................................................................Glossary–1

List of Figures Figures
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Figure 2-1. Elements of a Comprehensive Reliability Assurance Program..........2–2
Figure 6-1. Thermal Profile of Cyclic Moisture Resistance Test....................6–6
Figure B-1. Example of a Lognormal Probability Plot............................. B–4
Figure B-2. Goldthwaite Curves ................................................. B–5
Figure B-3. Nomograph for Calculating Random Failure Rates .................... B–7

List of Tables Tables
---------------------
Table 1-1. Definition of Quality Levels...........................................1–8
Table 3-1. Sample Format for Reporting Failure Rate Predictions ............... 3–11
Table 3-2. Sample Report Format for Reliability Test Status...................... 3–11
Table 4-1. Typical Characterization Tests for Branching Components.............4–2
Table 4-2. Required Reliability Tests ............................................4–4
Table 4-3. Test Matrix for Demonstrating Acceleration Factors...................4–6
Table 4-4. Typical Optical Parameters s for Branching Components ...............4–9
Table A-1. LTPD Sampling Plan................................................. A–1
Table B-1. Sample Format for Reporting Reliability Information .................. B–8

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